Hardware Design Services

Deploy optimized inference models directly on your devices. We leverage TinyML, NPUs, and quantization to deliver privacy-first, real-time AI solutions that don’t depend on the cloud.

 

End-to-end PCB design: schematic, layout, signal integrity, power distribution, thermal management

 

Multi-layer boards: high-density designs for IoT, wearables, robotics

 

Wireless integration: BLE, Wi-Fi, cellular antenna design and RF optimization

 

Power management: battery circuits, low-power design, energy harvesting

 

Manufacturing expertise: DFM optimization, production testing, supply chain management

 

50+ shipped products: wearables, industrial sensors, smart devices

OVERVIEW

HARDWARE DESIGN

Custom hardware design transforms product concepts into manufacturable, reliable electronics. This includes

  • Component selection and sourcing
    Circuit design (analog, digital, power, RF)
    PCB layout and manufacturing
    Design for manufacturability (DFM)
    Production testing and validation
Core Hardware Design Competencies

Circuit Design & Schematic Capture

  • We design circuits for microcontrollers, sensors, power management, communication (BLE, Wi-Fi, cellular), and custom analog/digital processing. Component selection optimizes cost, power, size, and availability.

PCB Layout & Signal Integrity

  • Multi-layer boards with proper trace routing
    Impedance control for high-speed signals
    Power distribution networks (PDN) for clean power
    EMI/RFI mitigation techniques
    Thermal design for heat dissipation
Power Management & Battery Design

Battery-powered devices demand extreme efficiency. We design

  • Low-quiescent-current power supplies (microamps when sleeping)
    Battery management systems (BMS) for safety
    Appropriate battery chemistry selection (Li-ion, Li-po, primary cell)
    Energy harvesting circuits (solar, kinetic)
Wireless Connectivity & Antenna Design

Wireless is critical for IoT. We design:

  • BLE/Wi-Fi/cellular circuits with matching networks
    Antenna designs (patch, monopole, ceramic) optimized for range/efficiency
    RF layout for signal integrity
    Regulatory compliance (FCC, CE, ISED)
Sensor Integration

We interface diverse sensors

  • Accelerometers, gyroscopes, magnetometers for motion
    Temperature, humidity sensors for environmental
    ECG/PPG sensors for biometric
    Pressure, force sensors for mechanical
    Optical sensors for vision
Design for Manufacturability (DFM)

We optimize designs for production:

  • Component selection (availability, cost, supply chain stability)
    Assembly process optimization (pick-and-place, reflow soldering)
    Testing strategies (in-circuit testing, functional testing)
    Yield improvement (design changes reducing defects)
Thermal Management

High-performance devices generate heat. We design:

  • Thermal paths for heat dissipation
    Appropriate heatsinks and thermal interface materials
    Thermal simulation predicting temperature distribution
    Component placement for optimal heat flow

DIFFERENTIATORS

KEY DIFFERENTIATORS

Full-Stack Hardware-Software Integration

Hardware engineers + firmware engineers working together. We optimize hardware for firmware requirements and firmware for hardware capabilities—no “throw it over the wall.

Low-Power Mastery

Battery-powered products are our specialty. We’ve designed systems running on coin-cell batteries for 5+ years—critical for remote sensors and wearables.

Ahmedabad ESDM Advantage

Based in Gujarat’s electronics manufacturing hub, we have deep relationships with PCB manufacturers, contract manufacturers, and component suppliers. This reduces costs and improves timelines.

Real-World Manufacturing Experience

We’ve brought 50+ products from prototype to production. We understand manufacturing bottlenecks, cost drivers, and yield issues—we design accordingly.

Component Sourcing & Supply Chain

Relationships with manufacturers and distributors. We navigate supply chain challenges, obsolescence planning, and cost optimization.

Wireless Expertise

BLE, Wi-Fi, cellular antenna design and RF optimization. We achieve range and efficiency that generic designs miss.

Rapid Prototyping & Iteration

We design for fast iteration: quick boards, testable designs, firmware-friendly interfaces. Fail fast, learn fast.

Overview

Technical Capabilities Deep Dive

  • Multi-layer board design (4-8 layers typical)
  • High-speed signal integrity: impedance matching, differential pairs
  • Power distribution: plane design, via stitching
  • Ground planes: low-impedance returns
  • Manufacturing tolerances: component placement, trace width, clearances

  • BLE circuit design: antenna matching, impedance
  • Wi-Fi: PCB antenna design, RF shielding
  • Cellular (LTE, 5G): modem integration, antenna design
  • Regulatory compliance: FCC, CE, ISED testing

  • Battery selection: chemistry, capacity, discharge curve
  • Charging circuits: constant-current/constant-voltage charging
  • Battery management systems (BMS): cell balancing, protection
  • Low-power design: sleep modes, clock gating, power domains
  • Energy harvesting: solar, kinetic, thermoelectric

  • Accelerometer/gyroscope: vibration, activity recognition
  • Temperature/humidity: environmental monitoring
  • ECG/PPG: biometric sensing
  • Optical: light sensors, proximity detection
  • Pressure/force: mechanical sensing

  • In-circuit testing (ICT): component-level testing
  • Functional testing: system-level validation
  • Environmental testing: thermal, humidity, vibration
  • Electromagnetic testing: EMI/RFI compliance
  • Burn-in testing: early failure detection

TECHNOLOGY STACK

PCB Design Tools

  • KiCad (open-source, affordable)
  • Altium Designer (professional, extensive)
  • Cadence Allegro (high-end)
  • Component libraries: standardized symbols and footprints

Manufacturing & Fabrication

  • PCB manufacturers: PCBway, Eurocircuits, local regional manufacturers
  • Contract manufacturers (CMAs): assembly, testing, logistics
  • Component distributors: Digi-Key, Mouser, local suppliers

Simulation & Analysis

  • SPICE simulation: circuit behavior
  • FEA (Finite Element Analysis): thermal and stress analysis
  • HFSS: electromagnetic field simulation for RF
  • Signal integrity: transmission line analysis

Testing Equipment

  • Oscilloscopes: signal measurement and timing
  • Multimeters: voltage, current, resistance measurement
  • Power analyzers: power consumption measurement
  • Logic analyzers: digital signal capture
  • Network analyzers: impedance and S-parameters

CAD & Mechanical

  • CAD software: SolidWorks, FreeCAD for mechanical design
  • 3D printing: rapid prototyping, enclosure design
  • Mechanical assembly: ensuring component fit and thermal paths

INDUSTRIES SERVED

Healthcare & Wearables

Applications:ECG/PPG monitors, glucose monitors, activity trackers
Key Requirements:Ultra-low power, medical-grade components, biocompatible materials

Robotics & Drones

Applications:Flight controllers, motor drivers, vision systems
Key Requirements:Real-time performance, power efficiency, compact size

Consumer IoT

Applications:Smart home devices, environmental sensors, wireless controls
Key Requirements:Cost optimization, reliable wireless, battery life

Smart Cities

Applications:Environmental sensors, parking systems, traffic monitoring
Key Requirements:Low cost at scale, long battery life, easy installation

Industrial IoT

Applications:Vibration sensors, temperature monitoring, asset tracking
Key Requirements:Ruggedness, harsh environments, long battery life

Automotive

Applications: Telematics units, ADAS sensors, EV battery management
Key Requirements:Automotive-grade components, thermal management, safety

CASE STUDY EXAMPLES

Akhila Labs supports a wide spectrum of healthcare and wellness applications:

Model 1: End-to-End Hardware Development

Best For: Companies building new hardware products from concept to manufacturing

Includes: Schematic design, PCB layout, prototyping, DFM, production support

Duration:  4–8 months typical

Cost Range: $100K–$300K

Model 2: Custom PCB Design

Best For:  Companies with concept, needing detailed PCB design

Includes: Schematic capture, PCB layout, manufacturing coordination

Duration: 4–6 weeks

Cost Range: $20K–$50K

Model 3: Hardware Architecture & Consultation

Best For: Strategic guidance on component selection, power budgets, wireless design

Includes:  Technology selection, architecture review, recommendations

Duration:  2–4 weeks

Cost Range: $15K–$40K

Model 4: Manufacturing & Production Support

Best For: Companies with design, needing manufacturing readiness

Includes:  DFM optimization, testing strategy, yield improvement

Duration: 6–12 weeks

Cost Range: $30K–$100K

Model 5: Prototyping & Rapid Iteration

Best For: Startups validating hardware concept quickly

Includes:  Rapid board design, 3D printing, quick iteration cycles

Duration: 6–8 weeks per iteration

Cost Range: $15K–$40K per cycle

INDUSTRIES SERVED

Frequently Asked Questions

At Akhila Labs, embedded engineering is the foundation of everything we build. We go beyond writing firmware that runs on hardware—we engineer systems that extract
maximum performance, reliability, and efficiency from the silicon itself.

Simple: $10-20K. Medium complexity: $30-50K. Complex with simulation: $75-150K. Includes schematic, layout, manufacturing coordination.

Yes. We often start with eval boards, quickly prototype to validate concept, then design custom board for production.

2-3 iterations: first for functionality, second for optimization, third for production readiness. Each iteration 2-3 weeks, costs $5-10K.

Analyzing design for production feasibility: component sourcing, assembly process, testing strategy, cost reduction. Takes 2-4 weeks, saves 20-30% manufacturing cost.

RF simulation, antenna design, proper PCB layout, testing with certified antennas. Takes 2-4 weeks additional. We aim for ±3dBm range variance.

 Energy profiling: measure sleep current, active current, transmission current. Firmware + hardware co-optimization reduces consumption 30-70% typically.

 We maintain relationships with distributors, identify alternative components early, design for commonality (use same MCU across products). Helps navigate supply issues.

Depends on complexity and volume. Simple: $5-15. Medium: $20-50. Complex: $100-500+. Volume discounts (10x reduction at 100K units).

Yes. We reverse-engineer existing boards, improve specific aspects (power, cost, features), redesign for next version. Takes 4-8 weeks.

Case Study 1: Scaling Global FinTech Platform – From 1M to 10M Users

Case Study 3: Industrial Vibration Sensor – Predictive Maintenance

Challenge A manufacturing equipment company needed vibration sensors for predictive maintenance across industrial facilities. The solution required a rugged design, reliable wireless mesh networking, and battery-powered operation with peak power consumption under 100mA. Solution High-Precision Sensing: 3-axis accelerometer (±16G range) for detailed vibration analysis. Edge AI Processing: STM32L476 MCU running anomaly detection algorithms locally. Mesh […]

Case Study 2: Medical-Grade Wearable ECG Monitor – FDA 510(k) Cleared

Challenge A healthcare startup needed to develop an ECG wearable that met FDA Class II requirements, using medical-grade components and biocompatible materials. The device also required ultra-low power consumption (under 2mA average) while maintaining clinical-grade accuracy. Solution Medical-Grade Components: Selected components meeting AEC-Q200 equivalent standards. Biocompatible Design: Silicone enclosure and electrode materials safe for prolonged […]

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